Process Control
Epner Technology’s quality philosophy is driven by a deep commitment to process control. It's one thing to develop a process that will produce good parts…quite another to produce those parts day in and day out. Tight process control makes it happen!
But the controlling of a plating process, which is after all, a dynamic system, is particularly daunting. The prep tanks, the plating tanks, the ubiquitous rinse tanks; each have an array of variables that must be held within defined upper and lower control limits, as defined by our Statistical Process Control program.
Primary Process Control Tools
- Atomic Absorption Spectrophotometer
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A key to maintaining each plating and prep line constituents upper and lower control limits is the Atomic Absorption Spectrophotometer. Able to measure a bath impurity down to one part-per-billion, the AAS is at the heart of Epner’s process control discipline.
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- Perkin-Elmer Spectrophotometer
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With its integrating sphere attachment, the Lambda 750 is the heart of Laser Gold quality maintenance. It measures total infrared reflectivity (i.e. specular and diffuse) in the range of from 700nm to 2500nm and is calibrated to the NIST Standard 2011.
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- X-Ray Fluorescence
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All XRF units can make non-contact thickness measurements and create statistical data.
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The Fisher Scope System XDL-XYMZ is unique in its ability to measure both individual and multiple layers of plating concurrently. At Epner, our XRF units are kept busy all day verifying that the customer’s specification is exactly met.
